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Co-authors
(539)
P. Markondeya Raj
84
Swapan Kumar Bhattacharya
63
Venky Sundaram
63
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60
Fuhan Liu
49
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Authors
Rao R. Tummala
Rao R. Tummala,Georgia Institute of Technology,Manufacturing Technology,Ceramics,New Materials
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Rao R. Tummala
Georgia Institute of Technology
Publications:
303
|
Citations:
2264
Fields:
Manufacturing Technology
,
Ceramics
,
New Materials
View FAQ about top research areas and Fields of study
Collaborated with
539 co-authors
from 1969 to 2012
|
Cited by
4309 authors
Cumulative
Annual
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Publications
(303)
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IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
S. W. RICKY LEE
,
JIE XUE
,
JEAN TREWHELLA
,
Hopewell Junction
,
R. WAYNE JOHNSON
,
THOMAS G. REYNOLDS
,
C. BAILEY
,
D. DONAHOE
,
P. D. FRANZON
,
L. W. SCHAPER
,
D. MALLIK
,
T. MATTILA
R. TUMMALA
http://academic.research.microsoft.com/io.ashx?type=5&id=57026318&selfId1=12536689&selfId2=0&maxNumber=12&query=
Published in 2012.
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
S. W. RICKY LEE
,
JIE XUE
,
JEAN TREWHELLA
,
Hopewell Junction
,
R. WAYNE JOHNSON
,
THOMAS G. REYNOLDS
,
C. BAILEY
,
D. DONAHOE
,
P. D. FRANZON
,
L. W. SCHAPER
,
D. MALLIK
,
T. MATTILA
R. TUMMALA
http://academic.research.microsoft.com/io.ashx?type=5&id=57026347&selfId1=12536689&selfId2=0&maxNumber=12&query=
Published in 2012.
Application of Piezoresistive Stress Sensor in Wafer Bumping and Drop Impact Test of Embedded Ultrathin Device
Xiaowu Zhang
,
Ranjan Rajoo
,
Cheryl S. Selvanayagam
,
Aditya Kumar
,
Vempati Srinivasa Rao
,
Navas Khan
,
Vaidyanathan Kripesh
,
John H. Lau
,
Dim-Lee Kwong
,
Venky Sundaram
,
Rao R. Tummala
Published in 2012.
Reliability Assessment of Through-Silicon Vias in Multi-Die Stack Packages
Xi Liu
,
Qiao Chen
,
Venkatesh Sundaram
,
Margaret Simmons-Matthews
,
Kurt P. Wachtler
,
Rao R. Tummala
,
Suresh K. Sitaraman
Journal:
IEEE Transactions on Device and Materials Reliability - IEEE TRANS DEVICE MATER RELIA
, vol. 12, no. 2, pp. 263-271, 2012
Suppression of Vertical Electromagnetic Coupling in Multilayer Packages
Nithya Sankaran
,
Suzanne Huh
,
Sunghwan Min
,
Madhavan Swaminathan
,
Rao Tummala
Published in 2012.
Sort by:
Citations
(2264 times by 1781 publications)
Thermal stability and electrical behavior of polydimethylsiloxane nanocomposites with carbon nanotubes and carbon black fillers
M Norkhairunnisa
,
A Azizan
,
M Mariatti
,
H Ismail
,
LC Sim
Journal:
Journal of Composite Materials - J COMPOS MATER
, vol. 46, no. 8, pp. 903-910, 2012
Linseed vinyl ester fatty amide toughened unsaturated polyester-bismaleimide composites
Mohandas Mandhakini
,
Subramani Devaraju
,
MuthuKumarasamy R. Venkatesan
,
Muthukaruppan Alagar
Journal:
High Performance Polymers - HIGH PERFORM POLYMERS
, vol. 24, no. 3, pp. 237-244, 2012
Crystallisation kinetics of mullite glass-ceramics obtained from alumina–silica wastes
A. Francis
,
S. Vilminot
Journal:
International Journal of Sustainable Engineering
, vol. ahead-of-p, no. ahead-of-p, pp. 1-8, 2012
Design of embedded capacitor with enhanced high-frequency performance
Bin-Chyi Tseng
,
Li-Chun Liao
Journal:
Journal of The Chinese Institute of Engineers - J CHIN INST ENGINEERS
, vol. 35, no. 2, pp. 141-149, 2012
Impact of Near-Surface Thermal Stresses on Interfacial Reliability of Through-Silicon-Vias for 3-D Interconnects
(
Citations: 4
)
Suk-Kyu Ryu
,
Kuan-Hsun Lu
,
Xuefeng Zhang
,
Jang-Hi Im
,
Paul S. Ho
,
Rui Huang
Journal:
IEEE Transactions on Device and Materials Reliability - IEEE TRANS DEVICE MATER RELIA
, vol. 11, no. 1, pp. 35-43, 2011
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