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Zhuqing Zhang

Zhuqing Zhang,Georgia Institute of Technology,Manufacturing Technology,New Materials,Chemistry

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Zhuqing Zhang

Georgia Institute of Technology

Publications: 46 | Citations: 187

Fields: Manufacturing Technology, New Materials, Chemistry

Collaborated with 38 co-authors from 2000 to 2007 | Cited by 457 authors

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Publications (46)

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Identification of amyloid fibril-forming segments based on structure and residue-based statistical potential (Citations: 20)

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Journal: Bioinformatics/computer Applications in The Biosciences - BIOINFORMATICS , vol. 23, no. 17, pp. 2218-2225, 2007

Study and characterization on the nanocomposite underfill for flip chip applications (Citations: 14)

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Journal: IEEE Transactions on Components and Packaging Technologies - IEEE TRANS COMPON PACKAGING T , vol. 29, no. 1, pp. 190-197, 2006

Mechanical and radiographic properties of a shape memory polymer composite for intracranial aneurysm coils (Citations: 10)

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Journal: Materials Science and Engineering: C , vol. 26, no. 8, pp. 1373-1379, 2006

Variable Frequency Microwave Synthesis of Silver Nanoparticles (Citations: 10)

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Journal: Journal of Nanoparticle Research - J NANOPART RES , vol. 8, no. 1, pp. 117-124, 2006

Study and characterization on the nanocomposite underfill for flip chip applications

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Journal: IEEE Transactions on Components and Packaging Technologies - IEEE TRANS COMPON PACKAGING T , vol. 29, no. 1, pp. 190-197, 2006

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Citations (187 times by 152 publications)

Cooperativity among Short Amyloid Stretches in Long Amyloidogenic Sequences

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Journal: PLOS One , vol. 7, no. 6, 2012

Optimal molecular structures of prion AGAAAAGA amyloid fibrils formatted by simulated annealing (Citations: 3)

Journal: Journal of Molecular Modeling - J MOL MODEL , vol. 17, no. 1, pp. 173-179, 2011

Development of wafer level underfill materials and assembly processes for fine pitch Pb-free solder flip chip packaging (Citations: 1)

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Conference: Electronic Components and Technology Conference - ECTC , pp. 1015-1022, 2011

Failure mechanism of 20 μm pitch microjoint within a chip stacking architecture (Citations: 1)

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Conference: Electronic Components and Technology Conference - ECTC , pp. 886-892, 2011

Achievement of low temperature chip stacking by a wafer-applied underfill material

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Conference: Electronic Components and Technology Conference - ECTC , pp. 1858-1863, 2011

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Co-authors (38)

Conferences (4)

Journals (8)

Keywords (112)

Zhuqing Zhang,Georgia Institute of Technology,Manufacturing Technology,New Materials,Chemistry

Publications (46)

BibTeX | RIS | RefWorks Download

Identification of amyloid fibril-forming segments based on structure and residue-based statistical potential (Citations: 20)

Study and characterization on the nanocomposite underfill for flip chip applications (Citations: 14)

Mechanical and radiographic properties of a shape memory polymer composite for intracranial aneurysm coils (Citations: 10)

Variable Frequency Microwave Synthesis of Silver Nanoparticles (Citations: 10)

Study and characterization on the nanocomposite underfill for flip chip applications

Citations (187 times by 152 publications)

Cooperativity among Short Amyloid Stretches in Long Amyloidogenic Sequences

Optimal molecular structures of prion AGAAAAGA amyloid fibrils formatted by simulated annealing (Citations: 3)

Development of wafer level underfill materials and assembly processes for fine pitch Pb-free solder flip chip packaging (Citations: 1)

Failure mechanism of 20 μm pitch microjoint within a chip stacking architecture (Citations: 1)

Achievement of low temperature chip stacking by a wafer-applied underfill material


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Zhuqing Zhang,Georgia Institute of Technology,Manufacturing Technology,New Materials,Chemistry

Publications (46) BibTeX | RIS | RefWorks Download

Identification of amyloid fibril-forming segments based on structure and residue-based statistical potential (Citations: 20)

Study and characterization on the nanocomposite underfill for flip chip applications (Citations: 14)

Mechanical and radiographic properties of a shape memory polymer composite for intracranial aneurysm coils (Citations: 10)

Variable Frequency Microwave Synthesis of Silver Nanoparticles (Citations: 10)

Optimal molecular structures of prion AGAAAAGA amyloid fibrils formatted by simulated annealing (Citations: 3)

Development of wafer level underfill materials and assembly processes for fine pitch Pb-free solder flip chip packaging (Citations: 1)

Failure mechanism of 20 μm pitch microjoint within a chip stacking architecture (Citations: 1)

Publications (46)

BibTeX | RIS | RefWorks Download