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Optimization of stiffness for isotropic conductive adhesives

Optimization of stiffness for isotropic conductive adhesives,10.1109/ISAPM.2010.5441385,Chune Fu,Si Chen,P. Berggren,Qiong Fan,Wenhui Du,B. Ganesh,J.

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Optimization of stiffness for isotropic conductive adhesives   (Citations: 2)
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With the rapid developments of electronic packaging, there is an increasing demand on high performance isotropic conductive adhesives (ICAs). However, the traditional ICAs are brittle, sensitive for crack formation and delamination, which is one of the major drawbacks that limits their use in a wide range of applications. Therefore great efforts have been made to make conductive adhesives more flexible. The present work aims at studying of several chemicals in terms of flexibilizing materials to modify the stiffness modulus of the conductive adhesives. The effect of the flexibilizers has been characterized by different methods, such as Differential Scanning Calorimetry (DSC), Dynamic Mechanical Analysis (DMA), Thermogravimetric Analysis (TGA), etc. Moreover, the electrical resistance, thermal conductivity and viscosity are also measured in various conditions. Experimental results indicate that one of the flexibilizing materials using flexible ester-linkage is particular of interest as it offers low electrical resistance, high thermal performance and low modulus without decreasing glass transition temperature (Tg) and influencing curing and decomposition conditions.
Conference: International Symposium on Advanced Packaging Materials - APM , 2010
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    • ...Although an exact explanation can not be given about the conductive mechanism of ICA, it has not had any effect on its extensive application in electronic industry and the rapid development of new production [1-3]...
    • ...For this reason, two kinds of formula based on multifunctional epoxies with good electrical and mechanical properties have been developed [2]...
    • ...All viscosity was measured under different speeds from 0.5 rpm to 5 rpm at room temperature [2]...
    • ...But the viscosity is still higher compared with the one which was developed in the earlier work [2, 7]...

    Wenhui Du, et al. New fast curing isotropic conductive adhesive for electronic packaging...

    • ...[1] To improve the properties of the ICAs, a new formula based multifunctional epoxy system with highly cross-linked functional aromatic structures has been developed [1-5]...
    • ...Thus, the inplane resistivity can be calculated by the formula given in equation 1. [2-4]...

    Wenkai Tao, et al. Reliability characterisation of Bimodal high temperature stable Isotro...

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